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Boeing To Use Intelleflex’ Chips for Dreamliner’s RFID Labels April 3, 2006

Boeing, the world’s largest aircraft manufacturer, chooses Intelleflex Corporation as its provider of silicon chips that shall enable the RFID “smart labels” to be used on maintenance-significant parts of the Boeing 787 Dreamliner.

The RFID smart labels to be used on the company’s mid-sized wide body passenger plane shall be applied on the parts during the manufacturing process and shall be used for enhanced data storage and collection.

Intelleflex’ silicon chips are ultra high frequency (UHF) silicon chips that have 64-kilobit memory, the largest memory available in the industry. Because of its bigger memory, more significant pieces of information about the history of the tagged parts can be quickly and easily obtained, anywhere and anytime.

In a press release, Mike Bair, the vice president and general manager of 787 says, “the use of RFID on the 787 Dreamliner will benefit our customers by reducing maintenance and inventory costs by providing detailed, electronic part tracking information on one small chip.”




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